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Chatting Ultra HDI: Chrys Shea, PCB Miniaturization & Challenges Ahead

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Manage episode 410295746 series 2890031
Inhoud geleverd door Altium LLC.. Alle podcastinhoud, inclusief afleveringen, afbeeldingen en podcastbeschrijvingen, wordt rechtstreeks geüpload en geleverd door Altium LLC. of hun podcastplatformpartner. Als u denkt dat iemand uw auteursrechtelijk beschermde werk zonder uw toestemming gebruikt, kunt u het hier beschreven proces https://nl.player.fm/legal volgen.

In this episode of the OnTrack Podcast, host Tech Consultant Zach Peterson explores the revolutionary world of Ultra HDI with Chrys Shea, President of Shea Engineering. The two unveil the future of PCB soldering and miniaturization, shedding light on the intricate challenges ahead and breakthroughs just on the horizon. Chrys, renowned for her expertise, shares invaluable insights into developing test vehicles for soldering and navigating the complexities of Ultra HDI assembly. This conversation promises a deep understanding of the cutting-edge advancements shaping the future of electronics manufacturing.

Don't miss out on the expert guidance and innovative strategies presented by Chrys Shea, a leading voice in the SMT assembly and PCB design world.

Key Highlights:

  • Introduction of Chrys Shea, president of Shea Engineering, discussing her involvement in developing test vehicles for soldering, particularly focusing on Ultra High-Density Interconnect (UHDI).
  • Discussion on the importance of having a plan upfront, particularly in terms of addressing defects and DFM (Design for Manufacturability) considerations.
  • Chrys Shea's background as an SMT (Surface Mount Technology) assembly process engineer and her transition to independent consulting, specializing in soldering.
  • Overview of the test vehicle developed for solder paste printing and its evolution to accommodate various soldering processes and component sizes, including BGAs, QFNs, and smaller passives.
  • Introduction of the new test vehicle for UHDI assembly, highlighting the increased density and challenges such as off-axis placements and the leading edge effect in stencil printing.

Further Resources:

  continue reading

100 afleveringen

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iconDelen
 
Manage episode 410295746 series 2890031
Inhoud geleverd door Altium LLC.. Alle podcastinhoud, inclusief afleveringen, afbeeldingen en podcastbeschrijvingen, wordt rechtstreeks geüpload en geleverd door Altium LLC. of hun podcastplatformpartner. Als u denkt dat iemand uw auteursrechtelijk beschermde werk zonder uw toestemming gebruikt, kunt u het hier beschreven proces https://nl.player.fm/legal volgen.

In this episode of the OnTrack Podcast, host Tech Consultant Zach Peterson explores the revolutionary world of Ultra HDI with Chrys Shea, President of Shea Engineering. The two unveil the future of PCB soldering and miniaturization, shedding light on the intricate challenges ahead and breakthroughs just on the horizon. Chrys, renowned for her expertise, shares invaluable insights into developing test vehicles for soldering and navigating the complexities of Ultra HDI assembly. This conversation promises a deep understanding of the cutting-edge advancements shaping the future of electronics manufacturing.

Don't miss out on the expert guidance and innovative strategies presented by Chrys Shea, a leading voice in the SMT assembly and PCB design world.

Key Highlights:

  • Introduction of Chrys Shea, president of Shea Engineering, discussing her involvement in developing test vehicles for soldering, particularly focusing on Ultra High-Density Interconnect (UHDI).
  • Discussion on the importance of having a plan upfront, particularly in terms of addressing defects and DFM (Design for Manufacturability) considerations.
  • Chrys Shea's background as an SMT (Surface Mount Technology) assembly process engineer and her transition to independent consulting, specializing in soldering.
  • Overview of the test vehicle developed for solder paste printing and its evolution to accommodate various soldering processes and component sizes, including BGAs, QFNs, and smaller passives.
  • Introduction of the new test vehicle for UHDI assembly, highlighting the increased density and challenges such as off-axis placements and the leading edge effect in stencil printing.

Further Resources:

  continue reading

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